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Capabilities - MicroLOGIX


Manufacturing is where chip shooters populate boards, connections are soldered, and assemblies receive board-level testing. MicroLOGIX's manufacturing methodology is based on continuous flow manufacturing (CFM) methods. Our CFM-driven processes eliminate product queues and waste, and reduce cycle times and costs, while giving MicroLOGIX greater scheduling flexibility and a higher degree of manufacturing excellence.

MicroLOGIX specializes in combining both surface-mount (SMT) and through-hole (THT) technologies into the same assembly, and CFM helps us do it very efficiently. Our kanban point-of use material delivery and floor stocking system puts components close to the point where they’re incorporated into assemblies.Work centers are arranged for the smooth transition of materials. MicroLOGIX manufacturing engineers drive customer cost savings by carefully balancing line speeds and cycle times to increase throughput and reduce wasteful handling.

Most importantly, MicroLOGIX's manufacturing team is customer focused. They’re experienced, highly skilled, proactive, and dedicated to our goals of exceeding customer expectations. As part of MicroLOGIX's continuous quality improvement, our manufacturing team is always in training to stay on top of the latest technologies and methods.

Assembly Capabilities

  • Surface-mount technology, including Ball Grid Array (BGA), μBGA, 0201, and Chip Scale Packages (CSP) capabilities
  • Through-hole assembly; radial and axial leaded components
  • Mixed technology
  • Test and assembly fixture design and development
  • Environmental encapsulation
  • Higher-level assembly and box build
  • In-circuit testing and final product functional testing
  • Automated Optical Inspection (AOI)
  • X-Ray inspectionlity
  • Retrofit and product modification

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Contact Information

473D, 13th Cross Road, Land Mark Brindavan Bus Stop, Peenya Industrial Area Phase IV, Bengaluru, Karnataka 560058

Phone : +91-80-40582180

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